Gold Sponsor of the 2008 HOLM Conference
North Attleboro, MA: September 25, 2008:
Checon Corporation is pleased to participate as a Gold Sponsor of the upcoming 2008 HOLM IEEE Conference on Electrical Contacts, October 27 – 29, in Orlando, Florida, USA. This will be the fourth year that Checon will co-sponsor this important technical forum covering the latest developments in the field of electrical contacts, contact materials and connectors. As a Gold Level Sponsor and active participant in the HOLM Intensive Course that precedes the conference, Checon is committed to helping this event deliver on its promise of a dynamic program featuring technical research and practical application information critical to our customers.
Engineers, designers and research scientists interested in learning more can contact Steve Carter, Checon Senior Sales Engineer at carter@checon.com, or go directly to the Conference website.











