Seam Welding/Omni Welding

Where size of contact and substrate material allows, Checon can offer Seamwelded assemblies as an alternative to Toplay. Seamwelding is particularly favored where contact material is being attached to heat-treatable materials and thin substrates. The process completely eliminates the braze interface between contact and substrate – further improving heat dissipation within the device – and eliminates a normal manufacturing step, thereby improving cost competitiveness. Our engineering team will be able to assess your application’s suitability for Seamwelding  – or our scaled up process; Omniwelding.