Checon's Toplay Contact Products - Now Available with Cadmium Free Materials

Checon is pleased to announce a new family of Cadmium Free powder metallurgical contact materials designed specifically for application with our line of Toplay products. The GTi series of AgSN02 materials, and the GNi series (AgNi), were created with enhanced ductility to enable fast and efficient manufacturing in the demanding Toplay process. The high ductility characteristic of the GTi and GNi materials is also an indicator of superior electrical and thermal traits vital to end-product life and contact reliability.

Toplay remains one of the most effective manufacturing methods for medium to high power devices such as contactors and industrial controls. This production method, utilizing in-line ultrasonic scanning to ensure consistency of the joint is fast and accurate. It produces a closely controlled, thin braze interface which aids electrical and thermal conduction and the completeness of the bond ensures maximum adhesion and reduction in material losses during electrical life due to contact peeling.

• In applications where parts are subjected to high mechanical loads, the Toplay process allows significant temper to be introduced into the assembly.
• Care and attention paid to the tooling design allows efficient material utilization and the improved thermal characteristics can lead to precious metal savings when evaluated with individually brazed assemblies. In comparison to Tip Brazing techniques, Toplay produces a more complete bond interface at significantly faster rates of assembly.

Checon Corporation Cadmium Free Powder Metallurgical Contact Materials